One limitation on the operating speed of electronic circuits is the ra
te at which the packaging can dissipate heat. In CMOS technology, the
heat generated by a processor is approximately proportional to its clo
ck rate. This paper examines the idea of using a variable-speed proces
sor (VSP) that can be operated at a high clock speed, and then slowed
down to a lower speed before heat accumulation destroys the circuit. U
nder a workload consisting of bursts of work alternating with idle per
iods (corresponding to cache misses or other delays), this results in
a higher average operating speed. This paper shows the optimality of a
bang-bang control for the clock rate. It also examines an easier-to-i
mplement policy that estimates the junction temperature through an upp
er bound, and uses this to control the clock rate. Closed-form express
ions are derived for the mean rate of instructions executed by a VSP u
sing each control method. Numerical studies show that both policies gi
ve substantial improvements in performance over a single speed process
or. Furthermore, the studies suggest that a VSP with a maximum clock r
ate of 2-4 times that of the single speed processor would suffice to o
btain the bulk of the performance improvement. In many cases, the aver
age throughput gain is on the order of 40-60%, without exceeding therm
al limits.