Laser ablation of solid targets by Ti:sapphire laser radiation is stud
ied. The solid targets are irradiated by 0.2-5000 ps laser pulses in t
he intensity range of 10(9) - 5 x 10(16) W/cm(2). Dependences of the a
blation depth on the laser pulse energy and pulse duration are discuss
ed. Advantages of sub-picosecond laser radiation for precise material
processing are demonstrated.