HIGH-TEMPERATURE CREEP OF LOW-DIELECTRIC-CONSTANT GLASS COMPOSITES

The constant-stress compressive creep behavior of a low-dielectric con stant (low-k) glass composite, containing a low-softening-point borosi licate glass (BSG) and a high-softening-point high silica glass (HSG), has been investigated at 800-950 degrees C. For all stages of creep, the deformation behavior exhibits linear viscoelasticity, and is contr olled by viscous flow of the low-softening-point borosilicate glass. A n analytical expression is proposed to describe mathematically the cre ep behavior of the glass composite, and the results show a fairly good agreement with experimental observations.