INTERFACIAL CRACK-GROWTH IN THERMOMECHANICALLY LOADED BIMATERIAL JOINTS

Citation
Kp. Herrmann et al., INTERFACIAL CRACK-GROWTH IN THERMOMECHANICALLY LOADED BIMATERIAL JOINTS, Composites. Part A, Applied science and manufacturing, 27(9), 1996, pp. 813-820
Citations number
15
Categorie Soggetti
Materials Sciences, Composites
ISSN journal
1359835X
Volume
27
Issue
9
Year of publication
1996
Pages
813 - 820
Database
ISI
SICI code
1359-835X(1996)27:9<813:ICITLB>2.0.ZU;2-E
Abstract
This paper considers quasi-static and dynamic propagation of straight and curvilinear interface cracks in brittle bimaterials subjected to m echanical crack surface loads and/or superimposed thermal strains acti ng along the ligament. Explicit stress intensity vector formulae are i ntroduced and discussed in view of interface mechanics features: appli ed loading, interface, crack-tip velocity and curvature of the interfa ce. In addition, the role of a bulk interphase layer between the adher ent bimaterial components is addressed by assessing numerically calcul ated mixed-mode energy release rates. Finally, crack kinking out of th e bulk interlayer (interphase) and the prospective kinking angle are i nvestigated.