CHARACTERIZATION OF A SMALL PERIPHERAL ARRAY PACKAGE

Authors
HAO J RICHTER A LASKAR J SWAMINATHAN M MOSLEY J
Citation
J. Hao et al., CHARACTERIZATION OF A SMALL PERIPHERAL ARRAY PACKAGE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 512-517
Citations number
4
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging → ACNP
ISSN journal
10709894
Volume
19
Issue
3
Year of publication
1996
Pages
512 - 517
Database
ISI
SICI code
1070-9894(1996)19:3<512:COASPA>2.0.ZU;2-B
Abstract
This paper provides details on a very small peripheral array (VSPA) ca vity package with high I/O's that is surface mountable on a printed ci rcuit board (PCB), The package consists of 320 leads and measures 27 m m on a side, This paper discusses the package attributes, comparison t o equivalent packages, and characterization of the package parasitics up to 3.5 GHz.