H. Tsunetsugu et al., A PACKAGING TECHNIQUE FOR AN OPTICAL 90-DEGREES-HYBRID BALANCED RECEIVER USING A PLANAR LIGHTWAVE CIRCUIT, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 569-574
A new technique has been developed for packaging an optical 90 degrees
-hybrid balanced receiver using a planar lightwave circuit (PLC) for t
he application to an optical homodyne detection system, This receiver
consists of a silica-based PLC as an optical coupler, two polarization
beam splitters (PBS's), two GRIN rod lenses to achieve perfect optica
l interconnections, two photoreceivers that each have a preamplifier,
and twin p-i-n photodiodes (PIN-PD's). The photoreceivers are fabricat
ed using microsolder bump bonding to eliminate parasitic elements in t
he interconnections between the preamplifiers and the PIN-PD's, An imp
edance-matched film carrier technique is used to achieve impedance-mat
ched interconnections between the preamplifiers and the ceramic packag
es, Experiments showed that a receiver fabricated using this packaging
technique has excellent performance: a broad-band frequency response
of 14 GHz and, consequently, 10-Gb/s binary phase shift keying (BPSK)
homodyne detection.