INTERCONNECT PROPAGATION DELAY MODELING AND VALIDATION FOR THE 16-MB CMOS SRAM CHIP

Citation
Vn. Rayapati et B. Kaminska, INTERCONNECT PROPAGATION DELAY MODELING AND VALIDATION FOR THE 16-MB CMOS SRAM CHIP, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 605-614
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709894
Volume
19
Issue
3
Year of publication
1996
Pages
605 - 614
Database
ISI
SICI code
1070-9894(1996)19:3<605:IPDMAV>2.0.ZU;2-5
Abstract
In this paper, a closed-form expression for complementary metal-oxide semiconductor (CMOS) static random access memory component (SRAM) chip propagation delay is developed, This allows accurate calculation of t he signal propagation delay of multilayer interconnects within the CMO S SRAM chip and also takes into account the delay of the CMOS SRAM cel ls driving the branched transmission line and the driving SRAM cell lo ading aspects of the interconnect line, Simulation results are present ed to show the accuracy and efficiency of the propagation delay model, A case study of 16 MB CMOS SRAM chip performance evaluation is presen ted, The proposed closed-form delay expression results in an absolute maximum error smaller than 4.8% in comparison to the measured data, Th e proposed closed-form expression can be used for various highspeed, h igh-density multilayer interconnect SRAM's, dynamic random access memo ries (DRAM's), FPGA's, and application-specific integrated circuits (A SIC's).