HIGHLY INTEGRATED 3-DIMENSIONAL MMIC SINGLE-CHIP RECEIVER AND TRANSMITTER

The three-dimensional monolithic microwave/millimeter wave integrated circuits (MMIC) structure that places thin polyimide-film layers on wa fers significantly increases the integration level of MMIC's. We newly develop 9.2-12 GHz receiver and 9.5-14 GHz transmitter chips with 20 dB gain using the three-dimensional MMIC technology, The receiver chip includes a four-stage front-end amplifier, a local oscillator (LO) am plifier, and an image-rejecton mixer in a 2 x 2 mm chip, The transmitt er chip also includes an IF amplifier with balanced outputs, an LO amp lifier, an RF buffer amplifier, and a balanced upconverter in a 1.9 x 1.9 mm chip, The integration levels of these chips are nearly three ti mes higher than those of conventional planar devices, The design metho d of each function block, such as the amplifier and mixer, is also des cribed.