H. Takao et al., 3-DIMENSIONAL VECTOR ACCELEROMETER USING SOI STRUCTURE FOR HIGH-TEMPERATURE USE, Electronics & communications in Japan. Part 2, Electronics, 79(3), 1996, pp. 61-72
In order to improve the high-temperature reliability of a silicon acce
lerometer, an accelerometer was fabricated using an SOI substrate and
its temperature dependence was compared with that of conventional sili
con accelerometers. In addition, the authors attempted to detect the t
hree-dimensional components of the acceleration vector using a new the
oretical principle. The new theoretical principle was validated, and a
ccelerometer design was carried out using a program for structure anal
ysis, ANSYS, which is based on the finite element method (FEM). It was
found that, in the accelerometer fabricated using an SOI substrate, t
he offset voltage and sensitivity at temperatures higher than 200 degr
ees C were superior to those in the conventional pn junction device. I
t was also found that the new device could detect acceleration even at
410 degrees C. Using the new device, the acceleration components in t
he three directions were accurately measured and the sensitivity for t
he other axis was suppressed to less than 5.7 percent. The frequency c
haracteristic of the new sensor was in agreement with the theoretical
results. Because of high-temperature operation and detectability of th
e three directional components of acceleration, this new accelerometer
will be much more widely used.