Zd. Stankovic et M. Vukovic, THE INFLUENCE OF THIOUREA ON KINETIC-PARAMETERS ON THE CATHODIC AND ANODIC REACTION AT DIFFERENT METALS IN H2SO4 SOLUTION, Electrochimica acta, 41(16), 1996, pp. 2529-2535
The effect of addition of thiourea on the kinetics of anodic dissoluti
on and cathodic reaction on copper and iron in acidic sulfate solution
s has been studied using potentiodynamic polarization measurements. Th
e results obtained in the presence of thiourea indicate that it has a
very strong influence on the kinetics of discharge processes at differ
ent metals. The presence of this organic compound led to decreasing ex
change current densities and to changes of Tafel slopes. The phenomeno
n observed is most likely the consequence of strong adsorption of thio
urea on the electrode surfaces of investigated metals. Copyright (C) 1
996 Elsevier Science Ltd.