FLEXIBLE VACUUM-PACKAGING METHOD FOR RESONATING MICROMACHINES

The vacuum packaging of resonant micromachined sensors using a solder reflow or brazing technique is disclosed. Various packaging processes, such as die adhesive selection and processing, solder selection and r eflow temperature are experimentally treated with respect to the Q-val ue obtained by both cantilever- and ring-shaped micromachines. The sta bility of nickel micromachines under low-amplitude resonant conditions is demonstrated using this packaging technique. The advantages of thi s packaging method for development and low-volume production devices a re presented.