This paper reports a new mounting technique for bonding silicon-Pyrex-
silicon stacks based on anodic bonding and alternating current (a.c.)
excitation. The bond is mechanically stable and strong enough to withs
tand a shear force of at least I MPa, or further reactive ion and wet
chemical etching processes. The technique has been optimized to be ind
ependent of various modifications of the stack dimensions or bonding p
arameters (e.g., temperature, voltage, quality of the contact).