This paper presents a review of the main properties of the two types o
f buried oxides that currently dominate the Silicon-On-Insulator (SOI)
technologies: SIMOX (Separation by IMplantation of OXygen) and BESOI
(Bond and Etch-Back SOI) materials. After examining the main advantage
s of SOI structures for radiation-hardened electronics, we present dif
ferent advanced technological processes of such buried oxides and revi
ew their physical characteristics as well as their charge trapping pro
perties under ionizing radiations.