W. Ensinger, PLASMA IMMERSION ION-IMPLANTATION FOR METALLURGICAL AND SEMICONDUCTORRESEARCH-AND-DEVELOPMENT, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 120(1-4), 1996, pp. 270-281
Plasma Source Ion Implantation, also termed Plasma Immersion Ion Impla
ntation, is a rapidly developing material modification technique for t
reating the near-surface regions of various kinds of materials. It mak
es use of high-energy ions which are accelerated by a high voltage pul
se from a plasma which wraps the workpiece to be treated. The ions are
implanted into the material causing effects similar to those of conve
ntional beam-line ion implantation. Research and development of plasma
immersion ion implantation has focused in two main fields, treatment
of metals for improved wear and corrosion performance, and modificatio
n of semiconductors. The paper discusses examples from both fields, wi
th nitrogen PIII of steels and aluminum, and modification of thin meta
l films. From the semiconductor field, trenchwall doping, ultra-shallo
w doping with boron, and oxygen ion implantation for SIMOX formation i
s treated.