TEM STUDY OF ELECTRODEPOSITED NI CU MULTILAYERS IN THE FORM OF NANOWIRES/

Citation
L. Wang et al., TEM STUDY OF ELECTRODEPOSITED NI CU MULTILAYERS IN THE FORM OF NANOWIRES/, Thin solid films, 288(1-2), 1996, pp. 86-89
Citations number
10
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
288
Issue
1-2
Year of publication
1996
Pages
86 - 89
Database
ISI
SICI code
0040-6090(1996)288:1-2<86:TSOENC>2.0.ZU;2-D
Abstract
Ni/Cu multilayers were electrodeposited within nanopores of polycarbon ate membranes. Morphology of the obtained nanowires, which are 60 simi lar to 80 nm in diameter and similar to 5 mu m in length, has been stu died by transmission electron microscopy. It has been observed that th e thickness of Ni/Cu layers increases as the nanowire is growing; Ni l ayers and Cu layers grow epitaxially and the multilayers have a prefer red growth direction [111] parallel to the wire axis.