INTERFACE FORMATION DURING SILICON DEPOSITION ON NOBLE-METAL SUBSTRATES - A COMPARATIVE AES STUDY

Citation
Iv. Lyubinetsky et Vk. Adamchuk, INTERFACE FORMATION DURING SILICON DEPOSITION ON NOBLE-METAL SUBSTRATES - A COMPARATIVE AES STUDY, Thin solid films, 288(1-2), 1996, pp. 182-185
Citations number
25
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
288
Issue
1-2
Year of publication
1996
Pages
182 - 185
Database
ISI
SICI code
0040-6090(1996)288:1-2<182:IFDSDO>2.0.ZU;2-M
Abstract
The room-temperature growth of evaporated silicon on copper, silver an d gold surfaces has been studied by Auger electron spectroscopy. All i nterfaces, including Si-Ag, are found to be reactive. The formation of the silicide-like bonds takes place from the very first stages of the Si deposition and only in an interface layer a few angstroms thick. H igher coverage results in the growth of a pure continuous Si film. For Si-Au system our data indicate the silicon diffuses into the gold.