CHARACTERIZATION OF VAPOR-DEPOSITION POLYMERIZED POLYIMIDE THIN-FILMS

Vapor deposition polymerized (VDP) polyimide (PI) thin films were prep ared and characterized by using thermogravimetrical analysis (TGA), sc anning electron microscopy (SEM), atomic force microscopy (AFM), Fouri er transform infrared (FTIR), and bending-beam techniques. The film pr operties investigated were thermal stability, wet-etching characterist ics, surface topology, imidization characteristics, internal stress up on curing and thermal cycling, and hygroscopic stress upon moisture di ffusion. Markedly different characteristics are observed for the VDP-P I films when comparing with the conventional ones. They seem denser in film structure and have better mechanical properties, but are somewha t less stable in thermal resistance. (C) 1996 John Wiley & Sons, Inc.