T. Tamai et M. Aramata, EFFECT OF SILICONE VAPOR CONCENTRATION AND ITS POLYMERIZATION DEGREE ON ELECTRICAL CONTACT FAILURE, IEICE transactions on electronics, E79C(8), 1996, pp. 1137-1143
The effect of silicone vapour concentration on the contact failure was
examined by using micro relays and motor brush-slip ring (commutator)
contacts. [(CH3)(2)SiO](4): D-4 was used as a vapour source of silico
ne contamination. Because the influence of the vapour of the silicone
on the contact surface can not be avoided at all times due to its grad
ual evaporation in the atmosphere. The contact failure caused by the s
ilicone vapour was confirmed as formation of SiO2 on the contact surfa
ce by analysis of EPMA and XPS. A minimum limiting concentration level
which does not affect contact reliability was found. This limiting le
vel was 10 ppm (0.13 mg/l). Validity of the limiting level was confirm
ed by the relationships among concentration, temperature, SiO2 film th
ickness and contact resistance. Furthermore, the effect of the degree
of silicone polymerization on the limiting concentration was derived b
y an empirical formula. This silicone is found to have polymerization
degree larger than D-7: n=7. These results were confirmed by the conta
ct failure data due to the silicone contamination.