D. Chinn et al., THERMAL AND MECHANICAL CHARACTERIZATION OF HIGH-PERFORMANCE EPOXY SYSTEMS WITH EXTENDED CURE TIMES, Journal of thermal analysis, 46(6), 1996, pp. 1511-1525
Five epoxy resins of different chemistry and functionality were cured
with DDS (4,4'-diaminodiphenyl sulfone) using 2, 8 and 14 h curecycles
. Both Differential Scanning Calorimetry (DSC) and Thermomechanical An
alysis (TMA) were used to characterize reaction behavior and cured pro
perties of the resin systems. In addition, static mechanical tests and
density measurements were integrated with the thermal characterizatio
n methods to correlate resin properties with process time. Flexural th
ree-point bending experiments showed that the resins tended to have hi
gher yield stress and toughness values at extended cure times. The imp
roved mechanical properties could be attributed to the full developmen
t of the epoxy molecular structure, in the form of cross-linked networ
ks and molecular rearrangement. These results suggest that extended cu
re times or high temperature post-curing may be required to obtain the
resin's ultimate mechanical properties for high performance composite
s.