GLP (GRINDING-LIKE POLISHING) USING MAGNETIC FLUID - SURFACE POLISHING CHARACTERISTICS OF SILICON-WAFER

Authors
SAKAYA K KUROBE T SUZUKI S HIROSAKI K
Citation
K. Sakaya et al., GLP (GRINDING-LIKE POLISHING) USING MAGNETIC FLUID - SURFACE POLISHING CHARACTERISTICS OF SILICON-WAFER, International journal of the Japan Society for Precision Engineering, 30(2), 1996, pp. 142-143
Citations number
2
Categorie Soggetti
Engineering, Mechanical
Journal title
International journal of the Japan Society for Precision Engineering → ACNP
ISSN journal
0916782X
Volume
30
Issue
2
Year of publication
1996
Pages
142 - 143
Database
ISI
SICI code
0916-782X(1996)30:2<142:G(PUMF>2.0.ZU;2-8