ADHESION FRACTURE OF A 2-LAYER AU EVAPORATED FILM WITH C, W AND CR MIXED

In order to increase the adhesion strength of the high-vacuum (about 3 .7 X 10(-3) Pa) Au evaporated film obtained by resistive heating, an A u film with C, W and Cr mixed was low-vacuum (about 1 Pa) evaporated a s the underlying layer (70-370 nm) by mixing the impurities from the e vaporation source. The measurements by the pull-down method indicated that the adhesion strength of the high-vacuum Au evaporated film (210- 370 nm) as the upper-layer film was as high as 2.0 X 10(7)-2.6 X 10(7) Pa. According to the adhesion fracture observation of the two-layer A u film, the probable cause of this high strength is that the lower-lay er film had the film structure of fine crystal grains (about 10 nm) an d WO2 had minute surface roughness, and the film fracture occurred in an adhesion layer region (10-30 nm) adjacent to the substrate.