A gas-laser-etching of Bi-Sr-Ca-Cu-O thin films was performed by digit
ally counting an etch process loop. Laser irradiation and NF3 gas-supp
ly were done separately. At one laser fluence range the etch depth was
independent of the laser fluence, suggesting that the etching was lim
ited by the amounts of adsorption gas molecules. The way that the etch
depth depends on the etching loop count was intensively investigated.
The depth was saturated after the etching of a few loops. The surface
s of the etched area were flattened and smoothened. Possible models th
at explain the etch depth saturation and surface flattening were discu
ssed.