EFFECT OF HALIDE-IONS ON ELECTROLESS NICKEL-PLATING

The effect of halide ions (F-, Cl-, Br-, I-) on nickel deposition in a cidic electroless nickel plating baths is investigated. Halide ions we re found to have a significant effect on the nickel deposition and the results could not fully be explained using mixed-potential theory. A correlation between the stability constants of halide ions with pallad ium (II) ions and the plating rate is proposed to explain the observat ions. Various parameters, such as the activation energy, deposit micro structure and phosphorus contents of the plating bath in the presence of various halide ions, were also studied.