E. Valova et al., INTERFACE WITH SUBSTRATES OF HIGH-PHOSPHORUS ELECTROLESS NIP AND NICUP DEPOSITED FROM NONAMMONIA ALKALINE-SOLUTIONS, Journal of the Electrochemical Society, 143(9), 1996, pp. 2804-2815
Electroless NiP and NiCuP alloys with high phosphorus content (11 to 1
3 weight percent) are plated from nonammonia alkaline baths onto alumi
num and iron substrates. Energy-dispersive spectroscopy analysis is us
ed to examine the chemical composition of the coatings. Scanning Auger
electron spectroscopy is applied to study elemental profiles and the
interface with the substrates. The zincate layer transformation at the
interface with the aluminum substrate is investigated at two bath tem
peratures. Nickel, phosphorus, and copper concentration is plotted aga
inst the coating thickness to examine the chemical homogeneity and to
obtain information about the mechanism of electroless ternary alloy fo
rmation on both types of substrates.