The standard method for back contacting to copper indium diselenide so
lar cells uses rf sputtered or e-beam evaporated molybdenum on a glass
substrate. These processes are costly with a high energy input. A new
simple technique has been proposed for the electroless deposition of
a nickel-molybdenum alloy on chromium-coated glass substrates. This te
chnique can also be applied directly to copper indium diselenide for a
backwall cell configuration. Improved mechanical and electrical perfo
rmances for this technique are reported.