T. Higa et N. Yamazoe, SINUSOIDAL POTENTIAL SCAN-BASED NICKEL EL ECTRODEPOSITION ON ANODIZEDALUMINUM .2. INFLUENCES OF SCAN POTENTIAL AND ANODIZED FILM THICKNESS, Denki Kagaku Oyobi Kogyo Butsuri Kagaku, 64(9), 1996, pp. 988-993
Influences of the cathodic potential and the anodized film thickness o
n the electrodeposition of nickel on anodized aluminum were investigat
ed in an NiSO4(5wt%)-H3BO3(4wt%)bath under a sinusoidal potential scan
. When the amplitude of the potential scan (Eo) was varied in the rang
e 1 similar to 38V while the anodized film thickness was fixed at 15 m
u m, three current peaks (I-s, I-1 and I-2)appeared at -3.43V, -10.82,
and -12.40V, vs. SCE, respectively. The amounts of Ni deposited at I-
1 were found to coincide with those of Ni2+ estimated film thickness w
as varied in the range 0.2 similar to 15 mu m with Eo fixed at 15V, th
e electrolytic behavior changed critically at the thickness of about 2
mu m. Hydrogen evolution took place almost exclusively on the films t
hinner than 2 mu m, while nickel deposition occurred on the thicker fi
lms leading to a steep decrease in the brightness index of the films.
Based on these results, mechanisms of nickel electrodeposition and hyd
rogen evolution were discussed.