THE EFFECT OF BISMALEIMIDE RESIN ON CURING KINETICS OF EPOXY-AMINE THERMOSETS

An analysis of the cure kinetics of several formulations composed of d iglycidyl ether of bisphenol-A (DGEBPA) and aromatic diamines, methyle nedianiline (MDA) and diaminodiphenyl sulfone (DDS), in the absence an d presence of 4,4'-bismaleimidodiphenylmethane (BM) was performed. The dynamic differential scanning calorimetry (DSC) thermograms were anal yzed with the help of ASTM kinetic software to determine the kinetic p arameters of the curing reactions, including the activation energy, pr eexponential factor, rate constant, and 60 min 1/2 life temperature. T he effects of substitution of one curing agent for another, their conc entration, and the absence and presence of BM resin and its concentrat ion on curing behavior, enthalpy, and kinetic parameters are discussed . (C) 1996 John Wiley & Sons, Inc.