R. Chandra et al., THE EFFECT OF BISMALEIMIDE RESIN ON CURING KINETICS OF EPOXY-AMINE THERMOSETS, Journal of applied polymer science, 62(4), 1996, pp. 661-671
An analysis of the cure kinetics of several formulations composed of d
iglycidyl ether of bisphenol-A (DGEBPA) and aromatic diamines, methyle
nedianiline (MDA) and diaminodiphenyl sulfone (DDS), in the absence an
d presence of 4,4'-bismaleimidodiphenylmethane (BM) was performed. The
dynamic differential scanning calorimetry (DSC) thermograms were anal
yzed with the help of ASTM kinetic software to determine the kinetic p
arameters of the curing reactions, including the activation energy, pr
eexponential factor, rate constant, and 60 min 1/2 life temperature. T
he effects of substitution of one curing agent for another, their conc
entration, and the absence and presence of BM resin and its concentrat
ion on curing behavior, enthalpy, and kinetic parameters are discussed
. (C) 1996 John Wiley & Sons, Inc.