A significant reduction in parasitic resistances and capacitances of t
he double mesa SiGe-HBT was achieved using several self-aligning proce
sses, such as planarisation for transistor contacts, outside-spacer-te
chnology for micromasking, contact implantations and low ohmic silicid
es. The authors present and analyse the lateral optimisation by on-waf
er measurements and simulations. It is shown that the fully self-align
ed transistor combines the advantages of superior high frequency chara
cteristics with a simple and low cost realisation procedure.