Coplanar waveguides were fabricated in standard complimentary metal-ox
ide semiconductor (CMOS) with postprocessing micromachining. IC's were
designed with commercial CAD tools, fabricated through the MOSIS(1) s
ervice, and subsequently suspended by maskless top-side etching, Absen
ce of the lossy silicon substrate after etching results in significant
ly improved insertion loss characteristics, dispersion characteristics
, and phase velocity, Measurements were performed at frequencies from
1 to 40 GHz, before and after micromachining, These show improvement i
n loss characteristics of orders of magnitude, For the micromachined l
ine, loss does not exceed 4 dB/cm. Before etching, loss as high as 38
dB/cm is measured, Phase velocity nu(p) approximate to 0.8 . c is achi
eved for the micromachined line.