Hh. Tsai et H. Hocheng, NUMERICAL INVESTIGATION OF TRANSIENT THERMAL-STRESSES OF WORKPIECE INSURFACE GRINDING, Journal of thermal stresses, 19(6), 1996, pp. 565-578
Thermal stresses on a ground surface are one of the main concerns duri
ng surface grinding. The purpose of this article is to investigate the
three-dimensional thermal stresses induced by grinding represented by
a moving triangular heat source. The solutions of transient thermal s
tresses are derived by the Goodier's thermoelastic potential and Galer
kin functions. The stresses are calculated numerically by the inverse
Fourier transformation and integration of Simpson's 3/8 rule. Results
show that the stress in the direction of the grinding depth is compres
sive and larger than the tensile stress along the feed direction. The
stresses near the grinding zone change drastically. The workpiece feed
rate is the main factor affecting the normal stresses. Cooling is esse
ntial in surface grinding, which can effectively reduce the normal str
esses to zero or perhaps to negative value.