TMN AND THE IMPLEMENTATION OF ELECTRONIC BONDING

Citation
S. Weese et al., TMN AND THE IMPLEMENTATION OF ELECTRONIC BONDING, IEEE communications magazine, 34(9), 1996, pp. 76-81
Citations number
3
Categorie Soggetti
Engineering, Eletrical & Electronic",Telecommunications
ISSN journal
01636804
Volume
34
Issue
9
Year of publication
1996
Pages
76 - 81
Database
ISI
SICI code
0163-6804(1996)34:9<76:TATIOE>2.0.ZU;2-A
Abstract
This article discusses the experiences learned in the implementation a nd deployment of electronic bonding. Electronic bonding refers to the use of TMN-based protocols for the exchange of information between ser vice providers. This is one of the first major deployments of TMN in t he U.S. telecommunications network. As was learned during this process , the development of standards is only a starting point. Many addition al agreements and decisions must be made in order to achieve deploymen t of TMN-based interfaces.