The recent progress in Si heterostructure technologies is reviewed fro
m physical and engineering viewpoints. Advanced methods to fabricate u
ltrashallow p-n junctions and high quality heterojunctions (SiGe/Si, m
u c-Si/SiC/Si) are developed to make a breakthrough in pushing back th
e limitation of Si-ULSI. Band engineering technology based on superstr
uctures is also established by developing atomic hydrogen assisted mol
ecular beam epitaxy. This opens up nsw expectations for Si-based optoe
lectronic integrated circuits, In addition, self-organized processing
for nano-structure fabrication is being developed to realize new-conce
pt quantum functional devices.