DEVELOPMENT OF CHIP SIZE PACKAGE

Corresponding to the demand of miniaturization for personal communicat ion tools, we have developed CSPs (Chip Size Packages) which have near ly the same outline size as LSI chip size, with an area array terminal . CSPs have both the merits of conventional packages and bare chips, a nd are expected as high density packages. Concerning CSPs packaging, w e made the most of conventional packaging technology, and performed th e same high reliability as the conventional packages. This paper descr ibes the features, effects and reliability of the CSP.