DUAL ION-BEAM DEPOSITION OF METALLIC THIN-FILMS

Citation
T. Sikola et al., DUAL ION-BEAM DEPOSITION OF METALLIC THIN-FILMS, Surface & coatings technology, 84(1-3), 1996, pp. 485-490
Citations number
21
Categorie Soggetti
Materials Science, Coatings & Films
ISSN journal
02578972
Volume
84
Issue
1-3
Year of publication
1996
Pages
485 - 490
Database
ISI
SICI code
0257-8972(1996)84:1-3<485:DIDOMT>2.0.ZU;2-6
Abstract
The influence of argon ion-beam bombardment of growing Al, Mo and Ti t hin films deposited by ion-beam sputtering on their composition and op tical properties was studied. The Ar ion energy and ion-to-atom arriva l ratio were 100-600 eV and 0.15-1.75 respectively. The concentration of Mo (Al) in the thin films decreased (increased) with ion energy as the Ar content increased (decreased). The Ti content was below 35% for all ion energies. The ratio O/Ti was close to the stoichiometric valu e of two for all ion energies up to 400 eV. Higher ion-beam energies a nd doses led to higher values of the index of refraction for Al and Ti thin films. Furthermore, an increase in the energy of the ions caused a decrease in the deposition rates of all films due to resputtering o f the thin film atoms and, in the case of Al thin films, intensified t he amorphization process in the Al/Si structure.