THERMAL-STABILITY OF SIS TUNNEL JUNCTION WITH SILICON BARRIER

Citation
I. Vavra et al., THERMAL-STABILITY OF SIS TUNNEL JUNCTION WITH SILICON BARRIER, Czechoslovak journal of Physics, 46, 1996, pp. 675-676
Citations number
3
Categorie Soggetti
Physics
ISSN journal
00114626
Volume
46
Year of publication
1996
Supplement
2
Pages
675 - 676
Database
ISI
SICI code
0011-4626(1996)46:<675:TOSTJW>2.0.ZU;2-X
Abstract
The thermal treatment of Nb/Si/Nb Josephson junction with high resisti ve amorphous silicon barrier (2nm thick) involves the interdiffusion a t Nb/Si interfaces even at 250 degrees C. In order to study these tiny interdiffusion process a superlattice [Nb(6nm)/Si(2nm)]10 (prepared at the same technological conditions as the Josephson junction) nas us ed for low angle x-ray spectroscopy. The interdiffusion yielding a sub layer of superconducting Nb-Si amorphous mixture at the interfaces was detected. This represents in the Josephson junction the decrease of S i-barrier thickness and consequently the increase of critical current in measured I-V characteristic.