A. Partridge et al., AN AFM INVESTIGATION OF THE DEPOSITION OF NANOMETER-SIZED RHODIUM ANDCOPPER CLUSTERS BY SPIN-COATING, Applied surface science, 103(2), 1996, pp. 127-140
Citations number
28
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
We have used atomic force microscopy to investigate the deposition of
nanometer-sized clusters by spin coating and it is shown that it is po
ssible to produce a homogeneous distribution of nanometer-sized Cu and
Rh particles using this technique. However, the formation of particle
s with a uniform size and distribution is not only dependent on the so
lute concentration and spin frequency, as has been discussed previousl
y, but also on a number of other factors, including: atmospheric humid
ity, solvent properties and the chemistry of the solute. In the case o
f the simple salts, Cu(NO3)(2) and RhCl3 dissolved in ethanol, particl
es precipitate out of the solution during spin coating and deposit ont
o the substrate. However, AFM and XPS analysis reveals that the use of
a Cu(acetate)(2) precursor results in the formation of a layer of Cu(
acetate)(2) on the substrate. This behaviour is attributed to the exis
tence of a larger metastable super-saturated region in the Cu(ac)(2) s
olution resulting from the presence of the acetate ligands. The layer
of Cu(ac)(2) is observed to form particles on calcination, the particl
e size and distribution being sensitive to the calcination rate. Possi
ble factors responsible for the ramp rate sensitivity are discussed. A
FM imaging of the surface following oxidation and reduction of the lar
ger Rh particles indicate that these particles break up as a result of
the treatment, where this behaviour is consistent with previous studi
es. Following this treatment, or after direct reduction in H-2, the Rh
particles are observed to exhibit a particle-substrate interaction, i
ndicated by the inability of the AFM to sweep the particles across the
surface. A similar behaviour is also determined to occur following ox
idation of the Cu particles.