Ls. Vempati et al., LOW-FREQUENCY NOISE IN UHV CVD EPITAXIAL SI AND SIGE BIPOLAR-TRANSISTORS/, IEEE journal of solid-state circuits, 31(10), 1996, pp. 1458-1467
In this work a comprehensive investigation of low-frequency noise in u
ltrahigh vacuum/chemical vapor deposition (UHV/CVD) Si and SiCe bipola
r transistors is presented, The magnitude of the noise of SiGe transis
tors is found to be comparable to the Si devices for the identical pro
file, geometry, and bias. A comparison with different technologies dem
onstrates that the SiGe devices have excellent noise properties compar
ed to AlGaAs/GaAs heterojunction bipolar transistors (HBT's) and conve
ntional Si bipolar junction transistors (BJT's), Results from differen
t bias configurations show that the 1/f base noise source is dominant
in these devices. The combination of a 1/Area dependence on geometry a
nd near quadratic dependence on base current indicates that the 1/f no
ise sources are homogeneously distributed over the entire emitter area
and are probably located at the polysilicon Si interface, Generation/
recombination (G/R) noise and random telegraph signal (RTS) noise was
observed in selected Si and SiGe devices. The bias dependence and temp
erature measurements suggest that these G/R centers are located in the
base-emitter space charge region, The activation energies of the G/R
traps participating in these noise processes were found to be within 2
50 meV of the conduction and valence band edges.