BI-EPITAXIAL GRAIN-BOUNDARIES IN YBA2CU3O7-X THIN-FILMS PREPARED BY PULSED-LASER DEPOSITION AND PULSED ORGANOMETALLIC BEAM EPITAXY - DIRECTCOMPARISON OF TRANSPORT-PROPERTIES AND GRAIN-BOUNDARY STRUCTURE
B. Vuchic et al., BI-EPITAXIAL GRAIN-BOUNDARIES IN YBA2CU3O7-X THIN-FILMS PREPARED BY PULSED-LASER DEPOSITION AND PULSED ORGANOMETALLIC BEAM EPITAXY - DIRECTCOMPARISON OF TRANSPORT-PROPERTIES AND GRAIN-BOUNDARY STRUCTURE, Journal of materials research, 11(10), 1996, pp. 2429-2439
A set of 45 degrees [001] bi-epitaxial YB2Cu3O7-x thin film grain boun
daries was studied to compare the effects of the microstructure on tra
nsport properties. The grain boundaries were made using two different
deposition techniques: pulsed laser deposition (PLD) and pulsed organo
metallic beam epitaxy (POMBE). The transport properties were highly de
pendent on the specific growth conditions used, resulting in both full
y resistive and superconducting grain boundaries. Subsequent microstru
ctural analysis of the measured boundaries showed that both types (sup
erconducting and resistive) meandered on the length scale of hundreds
of nanometers. The major structural difference between the boundaries
was at the atomic scale where the resistive boundary had a 1 nm wide d
isordered region. The direct correlation of microstructure to transpor
t properties demonstrates the importance of the atomic scale structure
in the resulting transport behavior.