BI-EPITAXIAL GRAIN-BOUNDARIES IN YBA2CU3O7-X THIN-FILMS PREPARED BY PULSED-LASER DEPOSITION AND PULSED ORGANOMETALLIC BEAM EPITAXY - DIRECTCOMPARISON OF TRANSPORT-PROPERTIES AND GRAIN-BOUNDARY STRUCTURE

Citation
B. Vuchic et al., BI-EPITAXIAL GRAIN-BOUNDARIES IN YBA2CU3O7-X THIN-FILMS PREPARED BY PULSED-LASER DEPOSITION AND PULSED ORGANOMETALLIC BEAM EPITAXY - DIRECTCOMPARISON OF TRANSPORT-PROPERTIES AND GRAIN-BOUNDARY STRUCTURE, Journal of materials research, 11(10), 1996, pp. 2429-2439
Citations number
30
Categorie Soggetti
Material Science
ISSN journal
08842914
Volume
11
Issue
10
Year of publication
1996
Pages
2429 - 2439
Database
ISI
SICI code
0884-2914(1996)11:10<2429:BGIYTP>2.0.ZU;2-#
Abstract
A set of 45 degrees [001] bi-epitaxial YB2Cu3O7-x thin film grain boun daries was studied to compare the effects of the microstructure on tra nsport properties. The grain boundaries were made using two different deposition techniques: pulsed laser deposition (PLD) and pulsed organo metallic beam epitaxy (POMBE). The transport properties were highly de pendent on the specific growth conditions used, resulting in both full y resistive and superconducting grain boundaries. Subsequent microstru ctural analysis of the measured boundaries showed that both types (sup erconducting and resistive) meandered on the length scale of hundreds of nanometers. The major structural difference between the boundaries was at the atomic scale where the resistive boundary had a 1 nm wide d isordered region. The direct correlation of microstructure to transpor t properties demonstrates the importance of the atomic scale structure in the resulting transport behavior.