TRANSFER OF STRUCTURED AND PATTERNED THIN SILICON FILMS USING THE SMART-CUT(R) PROCESS

Authors
ASPAR B BRUEL M ZUSSY M CARTIER AM
Citation
B. Aspar et al., TRANSFER OF STRUCTURED AND PATTERNED THIN SILICON FILMS USING THE SMART-CUT(R) PROCESS, Electronics Letters, 32(21), 1996, pp. 1985-1986
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronics Letters → ACNP
ISSN journal
00135194
Volume
32
Issue
21
Year of publication
1996
Pages
1985 - 1986
Database
ISI
SICI code
0013-5194(1996)32:21<1985:TOSAPT>2.0.ZU;2-U
Abstract
The feasibility of transferring patterned and multilayered thin films, simulating part of the stacked structure of a CMOS integrated circuit , from their original bulk silicon substrate to a final substrate, was demonstrated using the Smart-Cut process [1].