SrTiO3 thin films deposited by electron-cyclotron-resonance (ECR) plas
ma sputtering at 400 degrees C are investigated from the viewpoint of
leakage current and dielectric breakdown strength. 100-nm-thick SrTiO3
samples with 400 degrees C deposition followed by 400 degrees C oxyge
n annealing show low leakage current density (on the order of 10(-9) A
/cm(2) at 5 V) and high dielectric breakdown strength (> 4 MV/cm). SrT
iO3 thin films deposited by ECR sputtering at 400 degrees C are promis
ed for capacitor dielectrics of future 1-giga-bit dynamic-random-acces
s memories.