SPECIAL ISSUE ON SOLDER GEOMETRY - FOREWORD

Authors
HEINRICH SM
Citation
Sm. Heinrich, SPECIAL ISSUE ON SOLDER GEOMETRY - FOREWORD, Journal of electronic packaging, 118(3), 1996, pp. 113-113
Citations number
NO
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
Journal title
Journal of electronic packaging → ACNP
ISSN journal
10437398
Volume
118
Issue
3
Year of publication
1996
Pages
113 - 113
Database
ISI
SICI code
1043-7398(1996)118:3<113:SIOSG->2.0.ZU;2-Q