Raman scattering application was introduced to directly probe the dept
h profile of structural changes in a very thin surface layer of F+-imp
lanted Si by use of a single Ar+ laser (488 nm) excitation. The result
s of Raman scattering and sheet resistance measurement showed an unusu
al annealing behavior of the F+-implanted Si:In the range of annealing
temperature T-a from 200 degrees C to 400 degrees C, disordering was
observed to increase with increasing T-a but a stronger trend of order
ing with T-a increasing further above 400 degrees C. This abnormal beh
avior could be explained as due to competition between the ordering ef
fect of thermal annealing with increasing T-a and the disordering effe
ct of the implanted fluorine ions randomly breaking the Si-Si crystal
bonds in the surface diffusion layer. (C) 1996 American Institute of P
hysics.