Plasma polymerization generates thin, pinhole-free, and highly adherin
g films and is often described by the ratio of power to mass flow rate
(energy per mass). This research explores the relationships between p
lasma reactor parameters such as monomer flow rate, plasma power, and
reactor pressure and the rates of polymerization, etching, and deposit
ion. The chemical structure of the amorphous, crosslinked plasma polym
erized hexafluorapropylene consists largely of similar amounts of C-C
F, CF, CF2, and CF3 groups and some C-C groups. A dimensionless plasma
parameter (E) proportional to power and inversely proportional to flo
w rate cubed was derived. E, reflecting both plasma energy and residen
ce time, was used to describe various aspects of the plasma reactions.
A dimensionless exponential expression successfully described the dep
endence of pressure on E with a master curve. An expression for polyme
rization efficiency (polymer conversion) derived in part through a mas
s balance was also successfully related to E using an exponential mast
er curve. The rate of deposition was described as the difference betwe
en the rates of polymerization and etching. The deposition efficiency
maximum and plateau were successfully described by the difference betw
een polymerization and etching efficiencies, each related exponentiall
y to E. The technique used to derive parameters to describe the depend
ence of plasma reactions on plasma operating conditions can be applied
to any monomer/reactor system.