A STUDY OF THE CORROSIVE EFFECT OF SOLDERING FLUXES ON PRINTED-CIRCUIT BOARDS

Authors
GALVAN JC BASTIDAS JM FELIU S
Citation
Jc. Galvan et al., A STUDY OF THE CORROSIVE EFFECT OF SOLDERING FLUXES ON PRINTED-CIRCUIT BOARDS, Welding journal, 75(11), 1996, pp. 366-371
Citations number
21
Categorie Soggetti
Metallurgy & Metallurigical Engineering
Journal title
Welding journal → ACNP
ISSN journal
00432296
Volume
75
Issue
11
Year of publication
1996
Pages
366 - 371
Database
ISI
SICI code
0043-2296(1996)75:11<366:ASOTCE>2.0.ZU;2-S
Abstract
The corrosiveness of six commercial rosins used by the electronics ind ustry was studied. The copper sheet test, drop test and copper electro deposition test were used. The chloride content, pH and conductivity o f the aqueous rosin extracts were determined. Finally, the electrochem ical impedance spectroscopy (EIS) method was used. All six tests allow ed rosin corrosiveness to be studied. The EIS method allowed the corro sion rate to be quantified.