ADVANCES IN MATERIALS AND PROCESSES FOR HIGH-PERFORMANCE ELECTRONICS FABRICATION AND ASSEMBLY .1.

Authors
SEIBOLD RW LICARI JJ BROWN RL HARPER CA TRASK PA
Citation
Rw. Seibold et al., ADVANCES IN MATERIALS AND PROCESSES FOR HIGH-PERFORMANCE ELECTRONICS FABRICATION AND ASSEMBLY .1., S.A.M.P.E. journal, 33(1), 1997, pp. 27-34
Citations number
35
Categorie Soggetti
Material Science",Engineering
Journal title
S.A.M.P.E. journal → ACNP
ISSN journal
00911062
Volume
33
Issue
1
Year of publication
1997
Pages
27 - 34
Database
ISI
SICI code
0091-1062(1997)33:1<27:AIMAPF>2.0.ZU;2-L
Abstract
Five key advances in materials and processes for high-performance elec tronics fabrication and assembly an addressed. These advances are: 1) materials for thermal management; 2) low-temperature co-fired ceramics (LTCCs); 3) advanced organic printed circuit board (PCD) materials; 4 ) direct patterning of dielectric materials; and 5) environmentally fr iendly electronic materials and processes.