B. Haba et al., NOVEL TECHNIQUE OF THROUGH-HOLE LASER DRILLING IN TEFLON, Materials science & engineering. B, Solid-state materials for advanced technology, 41(3), 1996, pp. 383-385
In this manuscript, we report a novel technique in laser drilling of t
eflon films. The new process surpasses the conventional techniques in
simplicity, throughput and spatial resolution. The process consists of
three simple steps. First, a thin absorbing layer (in this case 300 A
ngstrom of gold) is deposited on the teflon to allow for the laser abs
orption. Second, the drilling is laser induced at the rate of one hole
per one-millisecond pulse. At this stage, the hole is not completely
open and debris still fills the hole. Third, the ultrasonic cleaning i
n water is used to remove the modified and weakly cleaning in water is
used to remove the modified and weakly bound material inside the dril
led holes. This new technique is desirable for packaging technique bec
ause of its drilling: speed as high as 60 000 holes per minute and its
low laser equipment cost. Copyright (C) 1996 Elsevier Science S.A.