Dd. Jatkar et B. Beker, EFFECTS OF PACKAGE PARASITICS ON THE PERFORMANCE OF SAW FILTERS, IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 43(6), 1996, pp. 1187-1194
Effects of package parasitics on the performance of SAW filters were e
valuated. A quasi-static approach based on the finite difference metho
d (FDM) in conjunction with current simulation method (CSM) was used t
o extract lumped element parameter values of common interconnections t
hat are found in typical SAW packages. The influence of bond wire conn
ections and package leads on the performance of common interdigital tr
ansducers (IDT's) was evaluated.