We examined charge generation in metal/tunnel-oxide/n-silicon diodes f
abricated with polycrystalline silicon (poly-Si) gates. In these devic
es, electron injection from the substrate in the direct tunnel regime
leads to charge generation which evolves with time rather than electro
n fluence, as has been previously reported for injection in the Fowler
-Nordheim tunnel regime. Our findings complete the picture proving the
existence of a distinct degradation mode in the direct tunnel regime
for devices fabricated at different facilities, using both aluminum an
d polycrystalline silicon gates, and stressed via either gate or subst
rate injection. This work directly impacts the prediction of the lifet
imes of devices in which direct tunneling is measurable.