S. Alam et al., CO-CURING STUDIES OF ETHYNYL TERMINATED OLIGOIMIDE AND (METHYL) NADICIMIDE RESINS, Journal of thermal analysis, 47(3), 1996, pp. 685-695
The paper describes the co-curing studies of ethynyl and ethenyl end-c
apped imide resins. The effect of composition and chemical structure o
f ethenyl end-capped resins (nadicimides) on thermal behavior of ethyn
yl end-capped resins was evaluated using DSC and thermogravimetric ana
lysis. An increase in char yield was observed on co-curing of few resi
n formulations. A mechanism has been proposed to account for this obse
rvation.