W. Wende et al., BINDING, BENDING AND CLEAVAGE OF DNA SUBSTRATES BY THE HOMING ENDONUCLEASE PI-SCEI, Nucleic acids research, 24(21), 1996, pp. 4123-4132
To characterize the interaction between the homing endonuclease PI-Sce
l and DNA, we prepared different DNA substrates containing the natural
recognition sequence or parts thereof. Depending on the nature of the
substrates, efficient cleavage is observed with a DNA containing simi
lar to 30 bp of the natural recognition sequence using supercoiled pla
smids, similar to 40-50 bp using linearized plasmids and > 50 bp using
synthetic double-stranded oligodeoxynucleotides. Cleavage of supercoi
led plasmids occurs without accumulation of the nicked intermediate. I
n the presence of Mn2+, DNA cleavage by PI-Scel is more efficient than
with Mg2+ and already occurs with substrates containing a shorter par
t of the recognition sequence. The requirements for strong binding are
less stringent: a 35 bp oligodeoxynucleotide which is not cleaved is
bound as firmly as other longer oligodeoxynucleotides. PI-Scel binds w
ith high affinity to one of its cleavage products, a finding which may
explain why PI-Scel hardly shows enzymatic turnover in vitro. Upon bi
nding, two complexes are formed, which differ in the degree of bending
(45 degrees versus 75 degrees). According to a phasing analysis bendi
ng is directed into the major groove. Strong binding, not, however, cl
eavage is also observed with the genetically engineered enzymatically
inactive variant comprising amino acids 1-277, Models for binding and
cleavage of DNA by PI-Scel are discussed based on these results.